Monolithic forming vs. Modular assembly
| Scheme type | Integrated Molded Structure (MIM) | Split assembly structure |
| Thermal resistance performance | No contact thermal resistance, shortest heat transfer path, higher efficiency. | There is contact thermal resistance at the interface, and the overall thermal resistance is 10% -15% higher. |
| structural strength | Strong rigidity, excellent resistance to vibration and thermal shock. | The assembly interface is weak point, easy to loosen and crack. |
| Manufacturing and efficiency | Single-step molding, short cycle, lower unit price after mass production dilution. | The multi-process circulation cycle is 30% longer, the labor cost is high, and the unit price is higher. |
| yield control | The yield is stable at over 98%, and the quality is highly consistent. | The yield decreased due to the problems such as virtual welding and assembly deviation. |
