The core technical advantages of MIM copper plate in optical modules focus on three dimensions: high thermal conductivity breakthrough, complex and precise structure molding, and production-level performance consistency. This perfectly solves the technical bottleneck of the traditional heat dissipation solution of 800G/1.6T high-power optical modules, and is the core technology path for the current high-speed optical module thermal management upgrade.
Thermal management performance technical advantages
Customized high thermal conductivity copper-based formula: through special pure copper powder ratio optimization, the thermal conductivity of MIM copper plate can reach 320W/m · K or more, which is 2 to 3 times that of the traditional zinc alloy optical module shell, and can reduce the overall temperature rise of 1.6T optical module by 5~ 10 ℃, completely solve the hot problem of local heat flux density of DSP chip exceeding 100W/cm ², and the signal error bit rate is reduced by more than 40%.
Weld-free micro-channel integrated molding technology: MIM process directly forms the complex micro-channel closed inside, completely eliminating the hidden danger of weld leakage in the traditional brazing splicing process, no flux residue inside the channel, and the cleanliness is greatly improved. The overall thermal resistance of the cold plate is reduced by 20% compared with the traditional welding process, and the power density of the supporting cabinet is increased from 15kW to 45kW.
Independent floating heat transfer patented design: equipped with an independent floating cold plate unit, through the built-in spring balance design, the fit between the cold plate and the optical module shell is increased by 90%, and the contact thermal resistance is greatly reduced; at the same time, the insertion of the optical module during hot swapping is completely avoided. The problem of sticking is controlled within ≤ 3 ° C of the temperature difference between the modules to achieve uniform heat dissipation of the whole module.
Advantages of precision structure forming technology
Complex special-shaped structure near net forming: special-shaped copper plates with dense heat dissipation needles, chutes, buckles, and positioning grooves can be injected at one time. Traditional CNC machining requires multiple clamping and multi-axis linkage, and some internal flow channels are even completely impossible to achieve. The MIM process can be completed with only a small amount of subsequent finishing, and the degree of freedom of structural design is increased by more than 60%.
Micron-level optical axis positioning accuracy control: The dimensional tolerance is stably controlled within ± 0.1%, and the precision base of TOSA/ROSA optical transceiver components can be integrally formed to ensure optical axis alignment accuracy and avoid optical signal insertion loss caused by assembly deviation. Adapt to 224G and above high-speed signal transmission requirements.
Ultra-thin thin wall forming ability: It can stably form ultra-thin heat dissipation shells with a wall thickness of less than 1mm. Traditional machined copper plates are prone to deformation and edge collapse at this thickness, and the yield of MIM parts can reach more than 98%. It is perfectly adapted to the compact interior space design of optical modules.
Material and mass production technology advantages
Performance optimization of high-density materials: After sintering, the density of the parts can reach more than 97%, the physical and chemical properties far exceed the traditional powder metallurgy copper plate, the tensile strength exceeds 400MPa, while maintaining more than 97% IACS conductivity, taking into account the triple performance of heat dissipation, structural support and electromagnetic shielding.
Multi-component integration technology: The traditional copper plate + positioning bracket + buckle multi-component assembly structure is injection molded into a single part, eliminating the need for multi-process assembly, and the overall yield is increased from 85% to more than 98%. The comprehensive production cost is reduced by more than 55% compared with traditional machined copper plates.
High-volume performance consistency guarantee: The production cycle is compressed from 72 hours to 8 hours for traditional machining, and it can be quickly switched from a few hundred pieces per day to hundreds of thousands per day. The thermal conductivity and dimensional tolerance deviation of all components are controlled within 2%, perfectly matching the annual shipment demand of optical modules of tens of millions.
Electromagnetic and reliability technology advantages
Copper-based native electromagnetic shielding performance: While deriving heat, the copper material itself can achieve excellent electromagnetic shielding effect, blocking external electromagnetic interference from invading the interior of the optical module, ensuring the transmission purity of high-speed signals of 224G and above, and adapting to the high-interference operating environment of AI servers.
Optimization of high wear-resistant plugging and unplugging performance: By customizing the copper alloy powder formula, while retaining high thermal conductivity, the hardness and wear resistance of components are greatly improved, and the industry pain points of soft pure copper and frequent plugging and unplugging are easily deformed are solved. The hot-plugging life of optical modules is increased by more than 3 times.
