The MIM copper plate has formed a full-chain mass production application in the optical module, covering the core heat dissipation, precision structural support, and liquid cooling adaptation of the 800G/1.6T high-speed digital optical module. It is the mainstream solution for the thermal management upgrade of high-power optical modules in AI computing power clusters.
1. High thermal conductivity copper alloy optical module housing
Application scenario: directly replace the traditional zinc alloy shell, as the main shell of the 800G/1.6T OSFP high-power digital light module, it is the fastest penetration rate of the current landing scene.
Core value: The thermal conductivity of custom copper alloy MIM parts can reach more than 320W/m · K, which is 2 to 3 times that of the traditional zinc alloy shell. It can reduce the overall temperature rise of the 1.6T optical module by 5 to 10 ° C. Completely solve the hot problem of local heat flux density of DSP chips exceeding 100W/cm ², and the signal error bit rate is reduced by more than 40%.
Progress in mass production: The MIM copper alloy optical module housings of leading manufacturers such as Jingyan Technology have been officially transferred to the batch supply stage. Relying on the existing MIM production line, it can flexibly match the demand for order climbing, and all production equipment and materials have been localized. It is currently in a critical penetration period of switching from traditional zinc alloy solutions to high-performance copper-based solutions.
2. TOSA/ROSA optical transceiver assembly precision base
Application scenario: As the core positioning base of the light emitting/receiving components inside the optical module, it replaces the traditional machined stainless steel components and is the core guarantee structure for the stability of optical signal transmission.
Core value: The MIM process can integrate complex chambers and micron-level positioning structures, with dimensional tolerances controlled within ± 0.1% to ensure optical axis alignment accuracy, avoid optical signal insertion loss caused by assembly deviation, and adapt to high-speed signal transmission requirements of 224G and above. The copper-based material also takes into account high thermal conductivity and electromagnetic shielding performance, and the heat dissipation efficiency is increased by more than 60% compared with the traditional stainless steel base, reducing the comprehensive production cost by 55%.
3. Integrally formed microchannel liquid-cooled cold plate
Application scenario: It is applied to the data center rack-type cold plate liquid-cooled optical module, replacing the traditional brazed and spliced copper cold plate, and adapting to the extreme heat dissipation requirements of the high-power optical module of the AI computing power cluster.
Core value: The MIM process directly integrates the internal enclosed complex micro-channel, completely eliminating the hidden danger of weld leakage in the traditional welding process. There is no flux residue inside the channel, and the cleanliness is greatly improved. The overall thermal resistance of the cold plate is reduced by 20% compared with the traditional welding process. The power density of the supporting cabinet is increased from 15kW to 45kW.
Mass production progress: related products have been shipped in bulk in energy storage and edge computing server scenarios, and are the core components of the current liquid-cooled data center optical module heat dissipation upgrade.
4. Cage cooling cold plate with independent floating structure
Application scenarios: Equipped with an optical module cage (Cage) cooling system, it is suitable for hot-swappable high-speed optical module operation and maintenance scenarios. The related technologies have been authorized by a number of national invention patents.
Core value: MIM process integrally forms a copper cold plate with an independent floating unit. Through the built-in spring equilibrium design, the fit between the cold plate and the optical module shell is increased by 90%, and the contact thermal resistance is greatly reduced. At the same time, it completely avoids the insertion delay problem when the optical module is hot-swappable, and the operation and maintenance efficiency is increased by more than 2 times. The parallel flow channel design can ensure the temperature consistency of each cold plate, and the temperature difference between the modules is less than or equal to 3 ° C.
5. Integrated heat dissipation pin and shield inside the optical module
Application scenario: As the exclusive heat sink and electromagnetic shielding cover of the DSP chip inside the optical module, it replaces the traditional split machining copper plate + shielding cover scheme.
Core value: The MIM process can integrate a large number of small heat dissipation needles and special-shaped shielding structures, without the need for subsequent assembly of multiple components, and the overall yield is increased from 85% to more than 98%; while deriving the concentrated heat of the chip, it blocks external electromagnetic interference from invading the interior of the optical module, ensuring the purity of high-speed signal transmission, and adapting to the high-interference operating environment of AI servers.
